Estimation of the degradation rate of multi-crystalline silicon photovoltaic module under thermal cycling stress

摘要

The overall power of an outdoor-exposed photovoltaic (PV) module decreases as a result of thermal cycling (TC) stress, due to the formation of cracks between the solder and metal. In this study, the thermal fatigue life of solder (62Sn36Pb2Ag) interconnection between copper and silver metallization in PV module was studied. This paper describes in detail the degradation rate (R_D) prediction model of solder interconnection for crystalline PV module. The R_D prediction model is developed which based on published constitutive equations for solder and TC test results on actual PV module. The finite element method was employed to study the creep strain energy density of solder interconnections in TC conditions. Three types of accelerated tests were conducted to determine the prediction model parameters. R_D in benchmark condition is predicted and compared with those of TC conditions.