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机译:用于冷却多LED封装的双压电风扇的热分析
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal 14300, Penang, Malaysia;
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal 14300, Penang, Malaysia;
Department of Aerospace Engineering, Universiti Putra Malaysia, Campus, Serdang 43400, Selangor, Malaysia;
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal 14300, Penang, Malaysia;
School of Material and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal 14300, Penang, Malaysia;
LED package; Piezoelectric fan; Transient numerical simulation; Fluent; MpCCI; Junction temperature;
机译:用于电子冷却的径向压电风扇(RPMF)的热分析
机译:双压电风扇冷却的针翅式散热器的传热特性
机译:多LED封装设计,制造和热分析
机译:多LED封装设计,制造和热分析
机译:微电子学中的三维封装的热机械分析以及功率电子学中的IGBT热测试仪的冷却技术。
机译:在热湿润环境中与风扇冷却套之间的运动突击件和运动后锻炼的冷却
机译:紧凑型电子设备的热分析。第二次报告。具有冷却风扇的便携式计算机的热分析。