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机译:印刷电路板基材的固化程度监控和热机械性能研究
State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, Fudan University, Shanghai 200433, China;
State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, Fudan University, Shanghai 200433, China;
State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, Fudan University, Shanghai 200433, China;
State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, Fudan University, Shanghai 200433, China;
State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, Fudan University, Shanghai 200433, China;
机译:废印刷电路板的重新利用弹性体复合材料中的非金属粉末:固化和机械性能的显着改善
机译:废印刷电路板的重新利用弹性体复合材料中的非金属粉末:固化和机械性能的显着改善
机译:来自计算机监控器和CPU的废印刷电路板的高温转变:残留物的表征和动力学研究
机译:废印刷电路板和印刷电路板的低温力学性能研究
机译:基于多层印刷电路板平台的基板集成波导的小型化技术。
机译:废印制线路板粉末非金属材料聚丙烯—木材复合材料加速风化性能的综合研究
机译:特殊文章:印刷电路板绝缘可靠性评价问题。适用于用于印刷电路板的电绝缘材料的介电特性的测量技术及其在绝缘性能估计的应用中的应用。