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Parametric defect localization on integrated circuits - From static laser stimulation to real-time variation mapping (RTVM)

机译:集成电路上的参数缺陷定位-从静态激光刺激到实时变化映射(RTVM)

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摘要

Laser stimulation techniques have been intensively used in the last decades to localize defects on integrated circuits. Although static techniques are efficient in many cases, they are not appropriate to tackle complex macro failure modes such as parametric defects. Dynamic laser stimulation techniques overcome these limitations but their implementation requires inserting a tester between the device under test and the fault isolation equipment, which may result in quite long acquisition times. Real-time variation mapping (RTVM) of a parametric failure can be achieved using FPGA-based tester architecture as described in this paper. Several use cases are presented and show the benefits of this implementation in terms of speed and complex failure localization.
机译:在过去的几十年中,已经广泛使用激光刺激技术来定位集成电路上的缺陷。尽管静态技术在许多情况下是有效的,但它们不适用于解决复杂的宏故障模式,例如参数缺陷。动态激光激励技术克服了这些限制,但是其实现需要在被测设备和故障隔离设备之间插入测试仪,这可能会导致获取时间较长。如本文所述,可以使用基于FPGA的测试仪架构来实现参数故障的实时变化映射(RTVM)。提出了几个用例,这些用例显示了该实现在速度和复杂故障定位方面的好处。

著录项

  • 来源
    《Microelectronics & Reliability》 |2014年第2期|366-373|共8页
  • 作者

    L. Saury;

  • 作者单位

    STMicroelectronics, 12 rue Jules Horowitz, F-38019 Crenoble Cedex, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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