...
首页> 外文期刊>Microelectronics & Reliability >Tin whisker analysis of an automotive engine control unit
【24h】

Tin whisker analysis of an automotive engine control unit

机译:汽车发动机控制单元的锡晶须分析

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

Since the 1970s, automobile manufacturers have used electronics for safety-critical automobile control systems such as acceleration, braking, and steering. These electronic systems introduced functionalities in automobiles that were not feasible in a purely mechanical framework, such as anti-lock braking systems and electronic stability control. However, failures of these electronic systems can lead to fatalities, financial losses, legal ramifications, and reputational liabilities for manufacturers. Therefore, automotive electronics must be designed to have minimum failures during use. In this paper, materials used in an automotive engine control unit (ECU) from a 2008 Toyota Tundra truck were analyzed. It was found that pure tin with a nickel underlayer was used as the connector finish in the unit, and analysis revealed tin whiskers on the connector surface. The use of pure tin finishes in electronics can produce conductive tin whiskers capable of creating unintended electrical failures such as short circuits. To assess tin whisker growth and the use of nickel as an underlayer material, the engine control unit was subjected to a standard temperature-humidity cycling test. The connectors showed tin whisker growth after testing, raising additional reliability and safety concerns. Recommendations for the automotive industry and National Highway Traffic Safety Administration are offered.
机译:自1970年代以来,汽车制造商已将电子设备用于对安全至关重要的汽车控制系统,例如加速,制动和转向。这些电子系统引入了在纯机械框架中无法实现的汽车功能,例如防抱死制动系统和电子稳定性控制。但是,这些电子系统的故障可能导致制造商死亡,经济损失,法律后果和声誉损失。因此,汽车电子产品必须设计成在使用过程中具有最小的故障。本文分析了2008年丰田Tundra卡车在汽车发动机控制单元(ECU)中使用的材料。发现该单元中的连接器表面使用了带有镍底层的纯锡,分析发现连接器表面上的锡晶须。在电子产品中使用纯锡涂层会产生导电锡晶须,该锡晶须会引起意外的电气故障,例如短路。为了评估锡晶须的生长以及使用镍作为底层材料,对发动机控制单元进行了标准的温度-湿度循环测试。测试后,连接器显示锡晶须生长,从而增加了其他可靠性和安全性问题。提供了针对汽车行业和国家公路交通安全管理局的建议。

著录项

  • 来源
    《Microelectronics & Reliability》 |2014年第1期|214-219|共6页
  • 作者

    Elviz George; Michael Pecht;

  • 作者单位

    Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, United States;

    Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, United States;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号