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机译:压装IGBT中可能的故障模式
Tech Univ Chemnitz, Chair Power Elect, Chemnitz, Germany|Tech Univ Chemnitz, EMC, Chemnitz, Germany;
SINTEF Energi AS, Trondheim, Norway;
Tech Univ Chemnitz, Chair Power Elect, Chemnitz, Germany|Tech Univ Chemnitz, EMC, Chemnitz, Germany;
Tech Univ Chemnitz, Chair Power Elect, Chemnitz, Germany|Tech Univ Chemnitz, EMC, Chemnitz, Germany;
SINTEF Energi AS, Trondheim, Norway;
Tech Univ Chemnitz, Chair Power Elect, Chemnitz, Germany|Tech Univ Chemnitz, EMC, Chemnitz, Germany;
Press-Pack; IGBT; Packaging; Simulation; Power Cycling; Reliability;
机译:压装式IGBT装置整体疲劳失效演化的建模与分析
机译:VSC-HVDC转换器中使用的压板IGBT器件短路故障的建模与分析
机译:vsc-hvdc的可靠性建模与分析通过考虑压力机IGBT和电容器故障
机译:压装式IGBT的动态热建模和分析,包括组件级和芯片级
机译:SiC P沟道绝缘栅双极晶体管(IGBTS)的建模。
机译:基于新型Volterra k最近邻最优修剪极限学习机(VKOPP)模型的绝缘栅双极晶体管(IGBT)剩余寿命估算
机译:压力包装IGBT的压力平衡及其对温度分布的影响研究