High speed test interface module using MEMS technology

摘要

At frequencies above a few gigahertz, testing integrated circuits becomes a challenging task. Test signal integrity degradation due to parasitic effects of interconnects and electromagnetic coupling undermine the test results and increase the yield loss of integrated circuits at high speeds. A new test interface module based on MEMS technology is proposed in this paper. High-speed micro test-channels are designed to establish connectivity between the device under test and the tester at the die level. Experimental results indicate that the proposed architecture can be used to test integrated circuits up to 50 GHz without much loss or distortion.