Thermal characterization of high power LED with ceramic particles filled thermal paste for effective heat dissipation

摘要

The next generation packaging materials are expected to possess high heat dissipation capability. Understanding the needs for betterment in the field of thermal management, the present study aims at investigating the package level analysis on a high power LED. In this study, commercially available thermal paste was heavily filled with ceramic particles of aluminium nitride (AlN) and boron nitride (BN) in order to enhance the heat dissipation of the device. Different particle sizes of AlN and BN fillers were incorporated homogenously into the thermal paste and applied as a thermal interface material (TIM) for an effective system level analysis employing thermal transient measurement. It was found that AlN TIM achieve less LED junction temperature by a difference of 2.20 ℃ compared to BN filled TIM. Furthermore, among D_(50) = 1170 nm, 813 nm and 758 nm, the A1N at D_(50) = 1170 nm was found to exhibit the lowest junction temperature of 38.49 ℃ and the lowest total thermal resistance of 11.33 K/W compared to the other two fillers.