机译:几何形状对可弯曲曲折互连单轴拉伸延伸疲劳可靠性的影响
Center for Microsystems Technology (CMST), Imec and Ghent University, Technology Park 914, B-9052 Gent-Zwijnaarde, Belgium;
LaBS, CMIC, Politecnico di Milano, Milan, Italy;
Center for Microsystems Technology (CMST), Imec and Ghent University, Technology Park 914, B-9052 Gent-Zwijnaarde, Belgium;
Center for Microsystems Technology (CMST), Imec and Ghent University, Technology Park 914, B-9052 Gent-Zwijnaarde, Belgium;
Center for Microsystems Technology (CMST), Imec and Ghent University, Technology Park 914, B-9052 Gent-Zwijnaarde, Belgium;
Philips Research, Philips Group Innovation, High Tech Campus 34/6.038, 5656AE Eindhoven, The Netherlands;
LaBS, CMIC, Politecnico di Milano, Milan, Italy,IRCCS, Istituto Ortopedico Galeazzi, Milano, Italy;
Imec, Kapeldreef 75, 3001 Leuven, Belgium;
SMI; Stretchable interconnect; High conductivity; Meandered interconnect; FEM; Weibull analysis;
机译:利用端接的平面弯曲铜导体的可拉伸互连的可靠性
机译:在平行和垂直于单轴拉伸方向上具有优先取向微晶的反应器内聚合物合金的拉伸变形:以耐冲击聚丙烯共聚物为例
机译:单轴拉伸疲劳对炭黑填充天然橡胶微观和介观结构演变的影响
机译:用有限元方法封装对单轴环状拉伸载荷下拉伸互连下疲劳寿命的影响
机译:陶瓷基复合材料在环境和高温下的拉伸和单轴/多轴疲劳行为。
机译:单轴拉伸疲劳对炭黑填充天然橡胶微观和介观结构演变的影响
机译:单轴拉伸疲劳对炭黑填充天然橡胶显微镜和介性结构演变的影响
机译:-170℃下普通钢纤维混凝土的单轴冲击拉伸性能