77 GHz automotive RADAR in eWLB package: From consumer to automotive packaging

摘要

RADAR technology as sensor for collision warning has been used in upper class vehicles for some years now. Assembling this electronic is highly sophisticated and therefore expensive. With new developments in SiGe-technology and semiconductor packaging RADAR technology is now available much smaller and cheaper. It is therefore affordable for mass-market in Advanced Driver Assistance Systems (ADAS) - which means "safety for everyone". This paper emphasizes the evolution from a consumer electronic package to an automotive package enduring the requirements relating to quality and reliability in these applications. Using 2nd level interconnect reliability as an example, we show the systematic approach utilizing "Design for Reliability" to enhance system properties. Particularly, the package board interaction and the solder joint performance regarding temperature cycling is discussed in matters of board material and build-up. (C) 2016 Elsevier Ltd. All rights reserved.