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3-D thermal models calibration by parametric dynamic compact thermal models

机译:通过参数动态紧凑热模型对3-D热模型进行校准

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Detailed 3-D thermal models of electronic systems require the calibration of unknown parameters to accurately describe the experimental data, which is usually obtained by a least square optimization of the measured transient thermal response to a given set of power inputs. This paper presents an extremely efficient technique to perform the identification of boundary conditions, material thermal properties, and geometrical sizes, which is based on the adoption of the trust region algorithm in combination with parametric dynamic compact thermal models. The calibration of parameters of a Package-on-Package system is performed by a simulated experiment procedure to validate the applicability and accuracy of the proposed approach. It is shown that using parametric compact models allows for a significant reduction in computational effort in comparison to conventional brute-force optimization. The calibration robustness with respect to input degradation is examined by observing the variation in the extracted parameters at different levels of noise. (C) 2017 Elsevier Ltd. rights reserved.
机译:电子系统的详细3-D热模型需要校准未知参数才能准确描述实验数据,通常是通过对给定的一组功率输入所测得的瞬态热响应进行最小二乘优化来获得的。本文提出了一种非常有效的技术来执行边界条件,材料热特性和几何尺寸的识别,该技术基于采用信任区域算法并结合参数动态紧凑热模型的情况。通过模拟实验程序对包装上包装系统的参数进行校准,以验证所提出方法的适用性和准确性。结果表明,与传统的蛮力优化相比,使用参数紧凑模型可以显着减少计算量。通过观察提取的参数在不同噪声水平下的变化,可以检查关于输入衰减的校准鲁棒性。 (C)2017 Elsevier Ltd.版权所有。

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