Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering

摘要

In this paper, authors developed an innovative packaging for a power inverter SiC MOSFET-Schottky. The design, composed by 6 SiC-MOSFET and 6 SiC-Schottky diodes, places dice between 2 direct-bonding-copper substrates, it was optimized to equilibrate thermal repartition on the two DBC surfaces. We purpose to increase thermal dissipation of power modules by the use of two water-cooling blocks disposed on top and on the bottom of our power inverter; it permits to use both sides of power module to dissipate heat flux. According to Finite Element Method simulations performed with ANSYS (R), double side cooling permits to enhance by up to two times thermal dissipation. Moreover solders are replaced by silver sintering and wire-bonds are suppressed by top substrate connections. We want to highlight that those improvements participates to increase reliability of power modules. (C) 2017 Elsevier Ltd. All rights reserved.