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Identification of foreign particles in packages of failed products by application of our modified failure analysis flow

机译:通过应用我们经过改进的故障分析流程来识别故障产品包装中的异物

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In this paper, two Failure Analysis (FA) examples are discussed of products which failed due to an electrical short or open. These cases were analyzed following our modified FA flow, where repeated mechanical polishing and inspection has replaced chemical decapsulation. Foreign particles were found close to the shorted or corroded (high resistive or electrical open) bond pads of these products. Subsequently, these particles could be characterized as Diamond-Like Carbon (10-50 mu m diameter) and partially degraded halogen-containing material (80-100 mu m diameter), respectively.
机译:在本文中,讨论了两个由于电气短路或断路而导致产品故障的故障分析(FA)示例。在改进的FA流程之后对这些情况进行了分析,在该流程中,重复的机械抛光和检查已取代了化学解封。在这些产品的短路或腐蚀(高电阻或电气断开)焊盘附近发现异物。随后,这些颗粒可以分别表征为类金刚石碳(直径为10至50微米)和部分降解的含卤素材料(直径为80至100微米)。

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