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Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP)

机译:通过传输线脉冲(TLP)瞬态分析SMD电容器中潜在的损坏形成

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Latent defects were provoked in SMD capacitors by short TLP current pulses. Simultaneously the transient evolution of the device's charge was extracted to generate its Q(V) characteristics and to determine its capacitive behaviour during the transient current stress. We could alter the capacitors so that normal operation was influenced only slightly, but the dielectric breakdown behaviour was considerably changed, which would result in an endangered application. The proposed method can generate and analyse those latent defects simultaneously. (C) 2017 Elsevier Ltd. All rights reserved.
机译:短TLP电流脉冲会在SMD电容器中引发潜在缺陷。同时,提取器件电荷的瞬态演变以生成其Q(V)特性并确定其在瞬态电流应力期间的电容行为。我们可以更改电容器,以使正常操作受到的影响很小,但是介电击穿行为却发生了很大变化,这将导致危险的应用。所提出的方法可以同时产生和分析那些潜在的缺陷。 (C)2017 Elsevier Ltd.保留所有权利。

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