机译:荧光粉转换白光LED芯片级封装的热/发光特性和降解机理分析
Hohai Univ, Coll Mech & Elect Engn, Changzhou 213022, Peoples R China|Changzhou Inst Technol Res Solid State Lighting, Changzhou 213161, Peoples R China|Delft Univ Technol, Beijing Res Ctr, Beijing, Peoples R China;
Hohai Univ, Coll Mech & Elect Engn, Changzhou 213022, Peoples R China|Changzhou Inst Technol Res Solid State Lighting, Changzhou 213161, Peoples R China;
Changzhou Inst Technol Res Solid State Lighting, Changzhou 213161, Peoples R China|Chinese Acad Sci, Inst Semicond, State Key Lab Solid State Lighting, Beijing 100083, Peoples R China;
Changzhou Inst Technol Res Solid State Lighting, Changzhou 213161, Peoples R China|Lamar Univ, Dept Mech Engn, Beaumont, TX 77710 USA;
Changzhou Inst Technol Res Solid State Lighting, Changzhou 213161, Peoples R China|Chinese Acad Sci, Inst Semicond, State Key Lab Solid State Lighting, Beijing 100083, Peoples R China|Delft Univ Technol, EEMCS Fac, Delft, Netherlands;
Phosphor-converted white LED; Chip scale packages; Multicolor phosphors; Thermal/luminescence characterization; Degradation mechanisms;
机译:传统和芯片规模包装白光LED光电和热性能的比较研究
机译:经受功率和热循环测试条件耦合的板级芯片级封装的瞬态热分析
机译:倒装芯片大功率LED的热特性和退化机理分析
机译:荧光粉转换的白光LED芯片级封装的热,光学和电气分析,包括实验和仿真
机译:具有热循环的嵌入式有源器件芯片级封装的应力分析。
机译:具有量子点转换器的高均匀性平面微型芯片级封装LED用于白光源
机译:磷光转换白光LED的封装效率及其对发光效率极限的影响