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Research on the effect of single-event transient of an on-chip linear voltage regulator fabricated on 130 nm commercial CMOS technology

机译:基于130 nm商业CMOS技术制造的片上线性稳压器单事件瞬变的影响研究

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We report single-event transient (SET) responses of an on-chip linear voltage regulator in 130 nm commercial standard CMOS technology by heavy ion experiments at first. Responses can be distinguished by the load current. When the light load current was applied, the negative SET on the output of the regulator larger than 200 mV was not observed, while the positive SETs that are larger than 400 mV and last for about 200 ns were observed. By comparison, when the heavy load current was applied, both positive and negative SETs that are larger than 400 mV and last for several hundred ns were observed. Next, the mechanism behind the phenomenon is analysed and then verified by the post-layout SPICE circuit simulation. It is demonstrated that the input voltage, load current and the load capacitance are key elements in determining the severity of SET. Finally, the most sensitive node is located by analysis and SPICE circuit simulation, which lies in the output of the amplifier inside of the bandgap reference (BGR). This result is a primary consideration in the development of the hardening technique. (C) 2017 Elsevier Ltd. All rights reserved.
机译:我们首先通过重离子实验报告了130 nm商业标准CMOS技术中片上线性稳压器的单事件瞬态(SET)响应。响应可以通过负载电流来区分。当施加轻负载电流时,未观察到稳压器输出大于200 mV的负SET,而观察到大于400 mV且持续约200 ns的正SET。相比之下,当施加重负载电流时,观察到大于400 mV且持续数百ns的正SET和负SET。接下来,分析现象背后的机制,然后通过布局后SPICE电路仿真进行验证。结果表明,输入电压,负载电流和负载电容是确定SET严重性的关键因素。最后,通过分析和SPICE电路仿真确定最敏感的节点,该节点位于带隙基准(BGR)内部的放大器输出中。该结果是硬化技术发展的主要考虑因素。 (C)2017 Elsevier Ltd.保留所有权利。

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