...
机译:常开的SONOS NOR闪存设备中LDD变化对漏极干扰的调查及其影响
Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai 200050, Peoples R China;
Shanghai Huahong Grace Semicond Mfg Corp, Shanghai 201203, Peoples R China;
Shanghai Huahong Grace Semicond Mfg Corp, Shanghai 201203, Peoples R China;
Shanghai Huahong Grace Semicond Mfg Corp, Shanghai 201203, Peoples R China;
Shanghai Huahong Grace Semicond Mfg Corp, Shanghai 201203, Peoples R China;
Shanghai Huahong Grace Semicond Mfg Corp, Shanghai 201203, Peoples R China;
Shanghai Huahong Grace Semicond Mfg Corp, Shanghai 201203, Peoples R China;
Shanghai Huahong Grace Semicond Mfg Corp, Shanghai 201203, Peoples R China;
Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai 200050, Peoples R China;
SONOS; Drain disturb; Lightly doped drain; TCAD simulation; Process optimization;
机译:LDD深度变化对SONOS NAND闪存设备性能特性的影响
机译:2晶体管结构闪存阵列中SONOS单元的漏极干扰的研究和工艺优化
机译:SONOS闪存EEPROM中的漏极干扰研究
机译:纳米透视闪存排水干扰源潜在影响的研究
机译:研究iOS设备上的无线多媒体功耗:计量应用程序工具的实现,网络流量模式分析和电池消耗率调查。
机译:SONOS闪存中氮化物内电荷迁移抑制的研究
机译:调查SONOS闪存EEPROM中的漏极干扰
机译:在某些EpROm,EEpROm,闪存和闪存微控制器211半导体器件以及包含它的产品中。调查编号337-Ta-395