机译:通孔过孔电镀铜薄膜的低周疲劳测试和热疲劳寿命预测
Shibaura Inst Technol, Grad Sch, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan;
Shibaura Inst Technol, Dept Mat Sci & Engn, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan;
Shibaura Inst Technol, Grad Sch, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan;
Shibaura Inst Technol, Dept Mat Sci & Engn, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan;
FUJITSU Adv Technol Ltd, Nakahara Ku, 4-1-1 Kamikodanaka, Kawasaki, Kanagawa 2118588, Japan;
FUJITSU Adv Technol Ltd, Nakahara Ku, 4-1-1 Kamikodanaka, Kawasaki, Kanagawa 2118588, Japan;
FUJITSU Adv Technol Ltd, Nakahara Ku, 4-1-1 Kamikodanaka, Kawasaki, Kanagawa 2118588, Japan;
Hitachi Chem Co Ltd, Chiyoda Ku, 1-9-2 Marunouchi, Tokyo 1006606, Japan;
Through hole via; Printed wiring board; Electroplated copper thin film; Low-cycle fatigue; Thermal fatigue; Fatigue failure mechanism; Temperature dependence; FEM;
机译:低周期热疲劳对汽车铸造模具的数值损伤和寿命预测
机译:高纯铝薄膜在热循环试验下的热疲劳
机译:疲劳测试过程中铜薄膜中单调应变的变化
机译:通孔电镀铜薄膜的低周疲劳试验和热疲劳寿命预测研究
机译:低周等温和热疲劳的损伤积分方法。
机译:AZ31镁合金低循环疲劳寿命预测的磁滞回线和应变能密度的综合建模
机译:裂纹生长预测降低循环疲劳的损伤评估(循环热应力下的疲劳寿命)
机译:残余应力和孔质量对飞机结构节点疲劳性能的评估。第1卷:压力分析,疲劳测试和生命预测