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Effect of microwave annealing on SOI MOSFETs: Post-metal annealing with low thermal budget

机译:微波退火对SOI MOSFET的影响:低热预算的金属后退火

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摘要

We investigate the effect of microwave irradiation (MWI) on silicon-on-insulator (SOI) based MOSFETs. The MWI technique is used for post-metal annealing (PMA) in air ambient, and compared with conventional thermal annealing in a forming gas ambient. This type of annealing not only constitutes a low cost, short time, low temperature, vacuum-free alternative to conventional post-metal annealing methods, but it also allows much lower thermal budgets, which, in turn, minimizes dopant motion, redistribution, and diffusion. The MWI treated MOSFETs showed superior electrical characteristics in terms of field effect mobility, on-off ratio, subthreshold swing, interface trap density, stability, and hot carrier effect immunity. Therefore, MWI technology is expected to become a promising annealing method for silicon-based processes, with low cost and low thermal budget (C) 2017 Elsevier Ltd. All rights reserved.
机译:我们研究了基于绝缘体上硅(SOI)的MOSFET的微波辐射(MWI)的影响。 MWI技术用于空气环境中的金属后退火(PMA),并与形成气体环境中的常规热退火进行比较。这种类型的退火不仅构成了传统金属后退火方法的低成本,短时间,低温,无真空的替代产品,而且还允许更低的热预算,从而最大程度地减少了掺杂物的运动,重新分布和扩散。经MWI处理的MOSFET在场效应迁移率,开/关比,亚阈值摆幅,界面陷阱密度,稳定性和热载流子效应抗扰性方面均表现出卓越的电气特性。因此,MWI技术有望以低成本和低热预算成为基于硅的工艺中一种有希望的退火方法(C)2017 Elsevier Ltd.保留所有权利。

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