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Characterization and modeling of dynamic variability induced by BTI in nano-scaled transistors

机译:纳米级晶体管中BTI引起的动态可变性的表征和建模

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In this paper, dynamic variability (DV) induced by BTI is deeply investigated in nano-scaled devices by means of statistical measurements and modeling. The impact of a single charge q on V-t is first investigated through 3D electrostatic simulations. In planar devices, this MC modeling allows proving that the average V-t shift induced by a single q denoted eta(t) is inversely proportional to the device area. In trigate 3D transistors, BTI trapping not only occurs at the top surface (TS) oxide but also at the device sidewalls (SW). For Pi fet Nanowire, this implies that eta(t) exhibits a complex variation with device scaling unlike in planar structures. In contrast, Finfet rather behaves as a vertical planar device for which SW plays now the role of TS. Finally the impact of device scaling on NBTI degradation is thoroughly studied in 3D technologies. Enhanced NBTI is measured on narrower devices. This phenomenon is well explained and reproduced by 3D MC simulations considering a poorer quality of the SW gate oxide with respect to its TS counterpart.
机译:在本文中,通过统计测量和建模,在纳米级设备中对由BTI引起的动态可变性(DV)进行了深入研究。首先通过3D静电仿真研究单电荷q对V-t的影响。在平面设备中,这种MC建模可以证明由表示为eta(t)的单个q引起的平均V-t偏移与设备面积成反比。在三栅极3D晶体管中,BTI捕获不仅发生在顶表面(TS)氧化物上,而且还发生在器件侧壁(SW)上。对于Pi fet纳米线,这意味着eta(t)在器件缩放方面表现出复杂的变化,这与平面结构不同。相比之下,Finfet更像是一种垂直平面设备,现在SW扮演TS的角色。最后,在3D技术中彻底研究了设备扩展对NBTI降级的影响。增强型NBTI在较窄的设备上进行了测量。考虑到SW栅极氧化物相对于TS栅极氧化物的质量较差,这种现象已通过3D MC模拟得到很好的解释和重现。

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