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Laser Beam Backside Probing of CMOS Integrated Circuits

机译:CMOS集成电路的激光束背面探测

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We have developed a new, fully integrated circuit timing analysis tool that provides measurement of electrical waveforms by direct access to the diffusion nodes through the backside of CMOS integrated ciucuits. The system, known as the IDS2000, allows the device to be driven at full speed by a wide variety of testers. Utilising an actively modelocked infrared laser beam, the systme can detect waveforms with ultrahigh bandwidth (~10 GHz) from CMOS devices using stroboscopic sampling. The systme has proven to be an powerful tool for design debug and failure analysis of flip chip packaged IC as well as any other packaged IC where the silicon side can be thinned and directly accessed.
机译:我们开发了一种新的全集成电路时序分析工具,该工具可通过CMOS集成电路的背面直接访问扩散节点来提供电波形的测量。该系统称为IDS2000,它允许各种测试仪全速驱动该设备。该系统利用主动锁模的红外激光束,可通过频闪采样从CMOS器件检测具有超高带宽(〜10 GHz)的波形。该系统已被证明是一种功能强大的工具,可用于倒装芯片封装的IC以及可减薄并直接访问硅面的任何其他封装IC的设计调试和故障分析。

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