FIB Voltage Contrast Measurement for Enhanced Circuit Repairs

摘要

Recent planar technoloies with 3 metal layers or more challenge curretn physical design modification capacities using Focused Ion Beam tools. Image visibity on the FIB is drastically reduced, making accurate positioning and milling operations in the area of interest more difficult. Despite the complexity of FIB modifications, however, the demand for circuit modifications continues to increase. We will present a method which brings voltage contrast measruement capabiltiyes to FIB systems. With this method, it is possible to verify the completion of FIB reqpairs.