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DEPASSIVATION OF LATENT PLASMA DAMAGE IN PMOS DEVICES

机译:去除PMOS设备中潜在的等离子体损伤

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摘要

While plasma-induced charging damage has been widely studided in recent years, much of the work has concentrated upon the mpact on n-channel MOSFET reliability [1-6]. Thsi work focuses the impact of plasma damage on pMOS devices from the viewpoint of oxide trapped charge and interface states with the experimntal featureing two parameters Q_p and △N_P, linked respectively to the oxide charge and the interface state density. This experimental method is valid for pMOS devices in two different technologies and permits to fully compare devices with different oxide thickness. Furthermore, we demonstrate that, fo ra given antenna, the plasma damage roughly has the same net impact on transistor characteristics, regardless of oxide thickness.
机译:尽管近年来已广泛研究了等离子体引起的充电损坏,但许多工作集中在影响n沟道MOSFET可靠性上[1-6]。从氧化物捕获的电荷和界面态的角度出发,这项工作着重于等离子体损伤对pMOS器件的影响,实验的特征是两个参数Q_p和△N_P分别与氧化物电荷和界面态密度相关。该实验方法对于采用两种不同技术的pMOS器件是有效的,并且可以完全比较具有不同氧化物厚度的器件。此外,我们证明,对于给定的天线,无论氧化物厚度如何,等离子体损伤对晶体管特性的影响大致相同。

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