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Advanced failure detection techniuqes in deep submicron CMOS integrated circuites

机译:深亚微米CMOS集成电路中的高级故障检测技术

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The test of present integrated circuits exhibits many confining aspects, among them the adequate selection of the observable variables, the use of combined testing approaches, an each time more restricted controllabity and obseravaility (physically and electrically) and finally the required testing time. In the paper these points are discussed and different nowadays-promising techniques exposed. complementarily to th elogic output variable analysis (both value and delay) three efficient detection and localisation theciques can be considered that are contemplated in this work: the detection of light, heat and leadage currents due to the presence of failures. In most of the cases it is not possible ot differentiate clearly, like was in the past, the production testing, hte in-field testing, the test and the localisation of the failure, making each time closer the fields of testing and failure analysis.
机译:当前集成电路的测试表现出许多局限性,其中包括可观察变量的适当选择,组合测试方法的使用,每次都受到更多的可控制性和陈旧性(物理上和电气上)以及最终所需的测试时间的限制。本文讨论了这些要点,并揭示了当今不同的有前途的技术。作为对逻辑输出变量分析(值和延迟)的补充,可以考虑在这项工作中考虑三种有效的检测和定位方法:检测由于故障的存在而产生的光,热和引线电流。在大多数情况下,不可能像过去那样清楚地区分产品测试,现场测试,测试和故障定位,从而每次都使测试和故障分析领域更加紧密。

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