Opticla method for the measurement of the thermomechanical behavious of electronic devices

摘要

We present in this paper a laser probing emthod for the sstudy of the surface deformation and thermomechanical behaviour of electronic components. The method has been applied to running power devices and creep analysis of solder joints in after-fabrication processes. The set-up allows following the whole surface deformation as a function of time even in the ling-term range. The method is based upon electronic speckle pattern interferometry (ESPI) adn allows measuring surface normal deformation with a 10nm resolution.