Contact Resistance Anomalies of Vias before Breakdown in Accelerated Current Life Tests

摘要

To test a new mehtod for reliabity assessment a two via test structure was designed including standard 4-point cotact pads for current supply and voltage measurement and additional intermediate contact pads allowing observation of voltage drop along lines and vias. Under special conditions the tests showed heavy anomalies of voltage drop between the intermediate contacts whcih are attributed to void development within the contact layers.