The reliabiltiy of IGBT modules was investigated with respect to the metallized ceramic (substrate) and the solder layer between the substrate and copper baseplate. Thermal cycles were performed between -55degC and ＋150degC on substrates based on different technologies and from varius manufacturers. An incipient delamination of the metallization could be predicted from the mechnaicla resonance frequency. The warping of the substrates after cycling due to crack propagation and the adhesion of the metallization were determined. Thermal and active-power cycles were performed on 1200A/3.3k V IGBT power modules to investigate the reliability of the solder joint between substrate and baseplate.
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机译：针对金属化陶瓷（基板）以及基板与铜基板之间的焊料层，研究了IGBT模块的可靠性。根据不同技术和各种制造商的不同，在基板上-55℃至+ 150℃之间执行热循环。可以根据机械共振频率预测金属化的初期分层。确定了由于裂纹扩展而引起的循环后基材的翘曲以及金属镀层的附着力。在1200A / 3.3k V IGBT功率模块上执行了热功率和有功功率循环，以研究基板和基板之间焊点的可靠性。
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