Enhancing IC repairs by combining laser direct-writing of Cu and FIB techniues

摘要

The aim of this work was to demonstrate the combination of laser direct-witing of Cu and FIB techniques. Preliminary electrical resistivtiy measurements and comparison between the pros and cons of both mehtods have been carried out. Some IC repair cases are presented where an FIB device has been used in combination with the laser deposition device developed in the microelectronics laboratory. Also, particular attention has been given to problems which are insoluble by the FIB techniue but readily resolved by the laser system.