首页> 外文期刊>Microelectronics & Reliability >Review of reliability issues of metal-semiconductor-metal and avalanche photonic detectors
【24h】

Review of reliability issues of metal-semiconductor-metal and avalanche photonic detectors

机译:金属半导体金属和雪崩光子探测器的可靠性问题综述

获取原文
获取原文并翻译 | 示例
       

摘要

In this paper, we present a brief review of the principal mechanisms that influence the reliability of metalsemiconductor-metal (MSM) interdigitated photodetectors and avalanche photodiodes (APD). The most important mechanism influencing reliability in these devices is the dark current. Howeve, other mechanisms such as edge and microplasmic breakdown and electrode degradation, can also affect device reliability. In this study, we describe numerical simuilation techniques that can be utilized to understand the workings of some of these mechanisms and illustrate their usage in a few reqpresentative devices. Specifically, we discuss how advanced drift-diffusion and hydrodynamic simulation techniuqes can be used to study the dark current as well as the location of breakdown in MSM and APD devices.
机译:在本文中,我们对影响金属半导体金属(MSM)叉指式光电探测器和雪崩光电二极管(APD)可靠性的主要机理进行了简要回顾。影响这些设备可靠性的最重要机制是暗电流。但是,其他机制(如边缘和微质击穿以及电极降解)也会影响器件的可靠性。在这项研究中,我们描述了数值模拟技术,可以用来理解其中一些机制的工作原理,并说明它们在一些代表性设备中的用法。具体而言,我们讨论了如何使用先进的漂移扩散和流体动力学仿真技术来研究暗电流以及MSM和APD设备中的击穿位置。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号