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Hot electrom degradation effects in 0.14 μm AlInAs//GaInAs/InP HEMTs

机译:0.14μmAlInAs // GaInAs / InP HEMT中的热电降解效应

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We report on hot electron stress emasurements on 0.14μm MOCVD grown AlInAs/GaInas/InP HEMTs. The stress measurements increase the drain-source current and hence induce a temporary negative shift in the threshold voltage in unpassivated HEMTs A permanent negative shift in the threshold voltage has been obtained in passivated HEMTs. The observed degradation (temporary/permanent) is due to the storage of positive charges (created by the impact ionization in the channel) in the Schottky AlInAs layer (temporary) or at the interface of semiconductor-passivation layer (permanent). For a given drain-source bias, a shift in the threshold voltage is larger in the gate-source bias region where the device has a mzximum transconductance value.
机译:我们报告了在0.14μmMOCVD生长的AlInAs / GaInas / InP HEMT上的热电子应力测量。应力测量会增加漏极-源极电流,从而在未钝化的HEMT中引起阈值电压的暂时负移。在钝化的HEMT中已获得阈值电压的永久负移。观察到的退化(暂时/永久)是由于在肖特基AlInAs层(暂时)或半导体钝化层的界面(永久)中存储了正电荷(由通道中的碰撞电离产生)。对于给定的漏极-源极偏置,在该器件具有最大跨导值的栅极-源极偏置区中,阈值电压的偏移较大。

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