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An evaluation of fast wafer level test methods for interconnect reliability control

机译:用于互连可靠性控制的快速晶圆级测试方法的评估

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摘要

A number of fast wafer level test methods exist for interconnect reliabiltiy evaluation. The relative abilities of three such methods to predict the quality and reliability of the interconnect over very short test times are evaluated in this work. Four different test structure designs are also evaluated and the results are compared with package level Median Time to Failure (MTF) results. The Isothermal test method combined wiht SWEAT-type test structures is shown to be the most suitable combination for interconnect reliability detection and control over very short times.
机译:存在许多用于互连可靠性评估的快速晶圆级测试方法。在这项工作中评估了三种这样的方法在非常短的测试时间内预测互连质量和可靠性的相对能力。还评估了四种不同的测试结构设计,并将结果与​​封装级的平均失效时间(MTF)结果进行了比较。等温测试方法与SWEAT类型的测试结构相结合,是在非常短的时间内进行互连可靠性检测和控制的最合适组合。

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