Copper metallization reliabiltiy

J.R.Lloyd; J.Clements; R.Snede

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Copper metallization reliabiltiy

机译：铜金属化可靠性

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The electromigration performance of Cu meatilization has been reviewed with an explanation as to why the advanage of Cu over Al alloys in the fine line regime is not as great as anticipated. Cu metailzation testing procedures are described and the dangers of "overstressing" are explained in some detail.

机译：回顾了铜肉化的电迁移性能，并解释了为什么在细线状态下铜在铝合金上的优势不如预期的大。描述了Cu成分测试程序，并详细解释了“过应力”的危险。

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《Microelectronics & Reliability》 |1999年第11期|1595-1602|共8页
作者
J.R.Lloyd; J.Clements; R.Snede;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类一般性问题;
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入库时间 2022-08-18 00:41:27

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Copper metallization reliabiltiy

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