A two-layer high density printed circuit board and its reliabiltiy

摘要

The fabrication and reliability of a two-layer high density PCB test vehicle are reported in this paper. The test board consisted through a photovia dielectric layer, Various test structures wer fabricated for reliability testing. Thermal cycling, 85degC/85RH ageing, and multiple reflow excursions were performed to test the reliability of electrical continuity and insulation. Peel strength was measured after fabrication as well as after 150degC annealing and reflow excursions. Initial results have revealed that photovias may be more relialbe than conventional through vias.