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Dislocation dynamics in heterojunction bipolar transistor under current induced thermal stress

机译:电流引起的热应力下异质结双极晶体管的位错动力学

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Dislocation generation and multiplicaiton in heterojunction bipolar transistors (HBTs) under electrical bias was studied using a finite element model. This model was developed ot solve a physicla viscoplastic solic mechanics problem using a time-dependent constitutive equation relating the dislocation dynamics to plastic deformation. The dislocatiosn in HBTs are generated by the excessive stresses including thermla stress generated by the temperature change in ht edevice during operation. It was found that the dislocation generation rate at the early stage and the statonary dislocation densities depend strongly on the current density.
机译:使用有限元模型研究了在电偏置下的异质结双极型晶体管(HBT)中的位错产生和倍增。该模型的开发是为了解决使用位错动力学与塑性变形相关的时变本构方程来解决粘胶塑性力学的问题。 HBT中的位移是由过大的应力产生的,其中包括由设备运行过程中温度变化产生的热应力。发现早期的位错产生速率和稳态的位错密度很大程度上取决于电流密度。

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