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首页> 外文期刊>Microelectronics & Reliability >Breakdown properties of metal/NIDOS SiO_2/silicion structures
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Breakdown properties of metal/NIDOS SiO_2/silicion structures

机译:金属/ NIDOS SiO2 /硅结构的击穿性能

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NIDOS/SiO_2/silicon structures have been annealed in a nitrogen (N_2) ambient and X-ray photoelectron spectoscopy (XPS) characterization has been performed in order to definitively demonstrate the nitrogen atoms out-diffusion from the nitrogen doped silicon (NIDOS) film to wards the buried oxide layer.The nitridation of the SiO_2 layer is related to the competition between nitrogen atoms out-diffusion phenomena on one side into the underlying oxide layer and on the other side into an oxynitride layer grown during annealing. In order to analyse and optimize the corresponding MIS process, different structures such as metal/SiO_2/silicon, metal (NH_3-'nitrided')SiO_2/silicon, metal/(N_2O-nitrided)SiO_2/silicon, metal/poly-Si*/SiO_2/silicon (*indicates deposited from disilane Si_2H_6) and metal/NIDOS/SiO_2/silicon have been ralized and compared by capacitance-voltage, currentvoltage and ageing under constant current injection experimetns. The optimization of the NIDOS-nitridation process gives the highest charge-to-breakdown for the lowest nitridation level or even for no intentional nitridation. The dielectric breakdown improvement should therefore not be related to the nitridation phenomena alone but also to the intrinsic properties of the polysilicon layer itself.
机译:NIDOS / SiO_2 /硅结构已在氮气(N_2)环境中进行了退火,并进行了X射线光电子能谱(XPS)表征,以明确证明氮原子从掺杂氮的硅(NIDOS)膜向外扩散到SiO_2层的氮化与一侧退火到底层氧化物层的氮原子向外扩散现象之间的竞争有关,而另一侧进入退火过程中生长的氮氧化物层之间的竞争有关。为了分析和优化相应的MIS工艺,使用了不同的结构,例如金属/ SiO_2 /硅,金属(NH_3-'氮化')SiO_2 /硅,金属/(N_2O氮化)SiO_2 /硅,金属/多晶硅-* / SiO_2 /硅(*表示从乙硅烷Si_2H_6沉积)和金属/ NIDOS / SiO_2 /硅已被混合,并在恒定电流注入实验下通过电容-电压,电流电压和老化进行了比较。 NIDOS氮化工艺的优化可实现最高的电荷分解率,从而实现最低的氮化水平,甚至无意进行氮化。因此,介电击穿的改善不应仅与氮化现象有关,而应与多晶硅层本身的固有性质有关。

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