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On the correlation between SILC and hole fluence throughout the oxide

机译:关于SILC与整个氧化物的空穴通量之间的相关性

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Stress-induced leakage current (SILC) has been recognized as a topic of concern in flash memory reliabiltiy. It is a reliable failure mechanism, occurring long before oxide breakdown and, hence, limiting ocide lifetime [1]. The physicla origin and mechanisms of SILC have not yet been clearly understood and several points open to discussion remain. In this work the role of oxide hloe fluence in producing the SILC is discussed. An universal power law of SILC generation kinetics is proposed versus the hole fluence throughout the oxide. The experimental results are theoretically validated by modeling the measured quantum-yield by the contributions of both anode hole injection and electron valence band injection mechanisms.
机译:应力引起的泄漏电流(SILC)已被认为是闪存可靠性中的一个关注问题。这是一种可靠的失效机理,发生在氧化物分解之前很久,因此限制了硫化物的寿命[1]。尚未明确了解SILC的生理起源和机制,尚有一些需要讨论的地方。在这项工作中,讨论了氧化物希洛通量在生产SILC中的作用。提出了SILC生成动力学的通用幂律与整个氧化物的空穴注量的关系。通过对阳极空穴注入和电子价带注入机制的贡献对测得的量子产率进行建模,理论上验证了实验结果。

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