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Electric breakdowns and breakdown mechanisms in ultra-thin silicon oxides

机译:超薄氧化硅中的电击穿和击穿机理

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It was found that the breakdown times meaured using time-dependent-dielectric-breakdown (TDDB) distributions could be shifted to shorter times when the amount of energy available during the breakdown event was increased. The TDDB ditrbiutiosn were non-unique and bu0012reakdwon models must account for both electrical breakdwons and dielectric breakdwn. A novel approach for obtaining breakdwon distributios will be presented. This approach uses a small number of oxides of oxides to obtain a time-dependent-electric-breakdown (TDEB) distribution, which will be shown to provide complementary information ot that obtained from (TDDB) distrbiutons. While the observation of dielectric breakdown in ultra-thin dielectrics may be difficult using standard test conditions, it will be shown that electric breakdowns are relatively easy to observe.
机译:已经发现,当击穿事件期间可用的能量增加时,使用时变介电击穿(TDDB)分布测量的击穿时间可以转换为更短的时间。 TDDB Ditrbiutiosn是非唯一的,并且bu0012reakdwon模型必须同时考虑电击穿和电击穿。将介绍一种获取破损分布的新颖方法。该方法使用少量的氧化物氧化物来获得随时间变化的电击穿(TDEB)分布,该分布将显示出可提供从(TDDB)双歧杆菌获得的补充信息。虽然使用标准测试条件很难观察超薄电介质中的电介质击穿,但将显示出电击穿相对容易观察。

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