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A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection

机译:用于自动化2.5D / 3D IC锁存验证和热线电检测的可编程检查器

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摘要

Many challenges accompany the use of three-dimensional (3D) integrated circuits (ICs). Some of these challenges are design-related, while others are verification-related. In this paper, we focus on verification issues; more precisely, on advanced layout physical verification tasks, such as advanced latch-up design rule checks and candidate hot junction detection. We explain the differences and additional challenges as compared to conventional two-dimensional (2D) IC verification. We introduce a programmable checker to automate these verification challenges for complete 3D IC designs. The checker differentiates between external and internal inputs/outputs from the assembly level without using layout markers on the die level. It checks external latch-up design rules using a topology-aware analysis, and checks mixed voltage latch-up design rules using a voltageaware analysis. It also detects candidate hot junctions, because their existence can cause damage if voltage rises too high and current is not sufficiently limited. A design is used to illustrate the different type of checks, and demonstrate how to set up required input constraints, share captured results/violations, and effectively debug results to overcome potential design weaknesses.
机译:许多挑战伴随着三维(3D)集成电路(IC)的使用。其中一些挑战是设计相关的,而其他挑战则与其他挑战有关。在本文中,我们专注于核查问题;更确切地说,在高级布局物理验证任务,如高级锁存设计规则检查和候选热结检测。与传统的二维(2D)IC验证相比,我们解释了差异和额外挑战。我们介绍一个可编程检查器,以为完整的3D IC设计自动化这些验证挑战。检查器在组件电平的外部和内部输入/输出之间区分,而不使用模具水平上的布局标记。它使用拓扑感知分析检查外部闩锁设计规则,并使用Voltageaware分析检查混合电压锁存设计规则。它还检测候选热连接,因为如果电压升高过高并且电流不足,则它们的存在可能会导致损坏。设计用于说明不同类型的检查,并演示如何设置所需的输入约束,共享捕获的结果/违规,并有效地调试结果以克服潜在的设计弱点。

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