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Improving avalanche robustness of SiC MOSFETs by optimizing three-region P-well doping profile

机译:优化三区P井掺杂型材改善SiC MOSFET的雪崩鲁棒性

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摘要

Avalanche robustness in dynamic operation is one of the main obstacles to further promote the commercialization of SiC MOSFETs. In this paper, a cell-level optimization design is proposed to suppress the avalanche failure caused by parasitic BJT activation. Several retrograde doping profiles with different thickness of lightly doping region (TLD) are designed for P-well, which is the key area affecting the avalanche failure. The analytical calculations and TCAD simulations show that as the TLD increases, the on-resistance decreases and the possibility of BJT activation increases. The TLD slightly larger than the thickness of the N+ can achieve a better avalanche capability without obvious degradation of the conduction characteristics. Besides, increasing the concentration of the retrograde P-well heavily doping region can improve the avalanche capability, but reduce the blocking voltage. This contradiction can be alleviated by adding a low-doped region at the bottom of the P-well to form a three-region P-well doping profile. This three-region P-well doping profile can achieve a significant improvement in the avalanche capability without degrading the conduction characteristic and blocking capability of the device, which provides meaningful guidance for the design of high avalanche robustness devices.
机译:动态操作中的雪崩鲁棒性是进一步促进SIC MOSFET商业化的主要障碍之一。本文提出了一种细胞级优化设计来抑制寄生BJT激活引起的雪崩衰竭。为P阱设计了具有不同厚度的诸如不同厚度(TLD)的逆行掺杂曲线,这是影响雪崩失败的关键区域。分析计算和TCAD模拟表明,随着TLD的增加,电阻降低,BJT激活的可能性增加。 TLD略大于N +的厚度,可以实现更好的雪崩能力,而不会明显地降解导通特性。此外,增加逆行P型井重掺杂区域的浓度可以提高雪崩能力,而是降低阻塞电压。通过在P阱的底部添加低掺杂的区域以形成三区P阱掺杂曲线,可以缓解这种矛盾。该三个区域P阱掺杂型材可以在雪崩性能的显着改善,而不会降低装置的导通特性和阻塞能力,这为高雪崩鲁棒性设备的设计提供了有意义的指导。

著录项

  • 来源
    《Microelectronics reliability》 |2021年第9期|114332.1-114332.5|共5页
  • 作者单位

    Xidian Univ Sch Microelect Key Lab Wide Band Gap Semicond Mat & Devices Xian 710071 Peoples R China;

    Xidian Univ Sch Microelect Key Lab Wide Band Gap Semicond Mat & Devices Xian 710071 Peoples R China;

    Xidian Univ Sch Microelect Key Lab Wide Band Gap Semicond Mat & Devices Xian 710071 Peoples R China;

    Xidian Univ Sch Microelect Key Lab Wide Band Gap Semicond Mat & Devices Xian 710071 Peoples R China;

    Xidian Univ Sch Microelect Key Lab Wide Band Gap Semicond Mat & Devices Xian 710071 Peoples R China|Xidian Wuhu Res Inst Wuhu 241000 Peoples R China;

    Xidian Univ Sch Microelect Key Lab Wide Band Gap Semicond Mat & Devices Xian 710071 Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    SiC MOSFET; Retrograde P-well doping; Avalanche reliability;

    机译:SIC MOSFET;逆行P-WELT掺杂;雪崩的可靠性;

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