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The influence of glass particle size on the interfacial bonding strength of Au/ceramic co-fired structure

机译:玻璃粒径对Au /陶瓷共烧结构界面粘合强度的影响

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摘要

Gold electrode is preferable in extreme environments, but few reports focus on gold electrode for LTCC application. In this article, CaO–B2O3–SiO2 glass powder used in the gold paste with different particle size was prepared. The sintering shrinkage behavior of CaO–B2O3–SiO2 green tapes and gold paste were investigated. The blisters of gold electrode and corresponding mechanism during sintering process were studied. The sheet resistivity and wire bonding strength of gold electrode were connected with glass particle size strongly. When the D50 of CaO–B2O3–SiO2 glass powder was 2.61 μm, the wire bonding performance of gold electrode was excellent, of which the average strengths and standard deviation of wire bonding were 10.30 g and 0.66 g, respectively. These results would have a positive effect on guiding the select of glass particle size in gold paste.
机译:在极端环境中,金电极优选,但很少有人报告LTCC应用的金电极。 在本文中,制备用于具有不同粒径的金浆中的CaO-B2O3-SiO2玻璃粉末。 研究了CaO-B2O3-SiO2绿色胶带和金浆的烧结收缩行为。 研究了烧结过程中的金电极和相应机理的衬垫。 金电极的薄层电阻率和引线键合强度强烈地连接玻璃粒度。 当CaO-B2O3-SiO 2玻璃粉末的D50为2.61μm时,金电极的线键合性能优异,其中引线键合的平均强度和标准偏差分别为10.30g和0.66g。 这些结果对引导金膏中的选择玻璃粒径产生积极影响。

著录项

  • 来源
    《Microelectronics reliability》 |2021年第2期|114039.1-114039.7|共7页
  • 作者单位

    College of Aerospace Science and Engineering National University of Defense Technology Changsha 410073 China;

    College of Aerospace Science and Engineering National University of Defense Technology Changsha 410073 China;

    College of Aerospace Science and Engineering National University of Defense Technology Changsha 410073 China;

    College of Aerospace Science and Engineering National University of Defense Technology Changsha 410073 China;

    College of Aerospace Science and Engineering National University of Defense Technology Changsha 410073 China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Blister; Cofiring; Interfacial bonding; Particle size;

    机译:水泡;cofiring;界面粘合;粒度;

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