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Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO_2/ Al_2O_3 laterally stacked gate oxide

机译:接口陷阱对源袋的电气性能特性对带HFO_2 / AL_2O_3横向堆叠栅极氧化物的源袋工程GE / SI异质结垂直TFET的影响

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This work reports the impact of interface trap charges (ITCs) on the electrical performance characteristics of a source pocket engineered (SPE) Ge/Si heterojunction (HJ) vertical TFET (V-TFET) with an HfO2/Al2O3 laterally stacked heterogeneous gate oxide (LSHGO) structure. SILVACO ATLAS (TM) 3-D TCAD tool has been used to compare various electrical performance parameters which includes DC parameters (i.e. I-ON, I-OFF, I-ON/I-OFF and subthreshold swing), RF figures of merit (i.e. transconductance, output conductance, cut-off frequency, the maximum frequency of oscillation, transit time, gain bandwidth product, transconductance generation factor (device efficiency) and transconductance frequency product) and linearity figures of merit (i.e. g(m2), g(m3), Third order voltage intercept point (VIP3), third intercept input power (IIP3), third order intermodulation distortion power (IDM3), 1-dB compression point and zero crossover point (ZCP)) of the proposed Ge/Si SPE-HJ-LSHGO-VTFET with their corresponding values of SPE-HJ-V-TFET with only Al2O3 as the gate oxide for both donor (+ve) and acceptor (-ve) interface trap charges at the gate oxide/channel interface. The reported study shows that the proposed HfO2/Al2O3 based SPE-HJ-LSHGO-V-TFET device is more immune to ITCs than the SPE-HJ-V-TFET device with only Al2O3 as the gate oxide.
机译:这项工作报告的界面陷阱电荷(ITC的)上工程改造的(SPE)的Ge / Si异质(HJ)垂直TFET(V-TFET)用的HfO 2 / Al2O3的横向堆叠异构栅极氧化物(源袋的电性能特性的影响LSHGO)结构。 SILVACO ATLAS(TM)3-d TCAD工具已被用于比较各种电气性能参数包括DC参数(即I-ON,I-OFF,I-ON / I-OFF和亚阈值摆幅),择优的RF数字(即跨导,择优的输出电导,截止频率,振荡的最大频率,渡越时间,增益带宽积,跨导生成因子(设备效率)和跨导频产品)和线性数字(即克(平方米),G(立方米),三阶电压截取点(VIP3),第三截距输入功率(IIP3),第三阶互调失真功率(IDM3),1dB压缩点和所提出的锗/硅SPE-的零交叉点(ZCP)) HJ-LSHGO-VTFET与其作为两个供体的栅极氧化物对应SPE-HJ-VTFET的值只有氧化铝(阳离子),并在栅氧化物/信道接口受体(-ve)界面陷阱电荷。所报告的研究表明,所提出的基于的HfO 2 / Al2O3的SPE-HJ-LSHGO-V-TFET设备是更不受ITC的比仅氧化铝的SPE-HJ-V-TFET设备作为栅极氧化物。

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