Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly

摘要

This study evaluates the impact of intermetallic compound (IMC) thickness on thermo-mechanical reliability of lead-free SnAgCu solder joints in crystalline silicon solar cell assembly with regard to fatigue life. Finite element modelling is used to simulate the non-linear thermo-mechanical deformation of the joints. Five geometric models of solar cell assemblies with different IMC thickness layers in the range of 1 to 4 mu m are utilized. The models were subjected to accelerated thermal cycling from 40 degrees C to 85 degrees C employing IEC 61215 standard for photovoltaic panels. Creep response of each of the assembly's solder joints to the induced thermal load were simulated using Garofalo-Arrhenius creep model. Simulation results indicate that when IMC thickness grows incrementally to 1, 2, 2.5, 3 and 4 mu m, thermo-mechanical fatigue life of solder joints diminishes to 13,800, 11,800, 10,600, 9400 and 7800 cycles to failure respectively. Thus, solder joint fatigue life decreases as the IMC thickness increases during service lifetime. Therefore, proper design of solder joint in crystalline silicon solar cell assembly must include consideration of IMC layer thickness to prevent premature failure and to ensure fulfilment of desired functional lifetime of 13,688 cycles to failure (25 years).