Reliability study of PCB-embedded power dies using solderless pressed metal foam

摘要

This paper presents a reliability study of an innovative process of embedding power dies in PCBs. Firstly, a description of this solderless package is given. Secondly, experimental tests of thermal ageing for the proposed package are performed through passive thermal cycling in the range of PCB standards. Thirdly, a 2D finite element model of the package is built using material properties obtained from previous thermomechanical characterizations. Numerical simulations of a passive thermal cycling of the package are carried out. The analysis of the strain-stress fields allows to highlight the time-space areas where they are critical and compromise the reliability.