Gold wire bond study for automotive application

摘要

In this publication, the influence of bond wire material properties (Au 2N/4N), and plasma pre-treatment on the wire-bond strength is investigated based on Automotive Electronics Council Qualification (AEC-Q100) and customer requirements. The wire pull force capability is compared, and growth of the Au/Al intermetallic phase (IMP) is analyzed with scanning electron microscope (SEM) cross sections after High Temperature Storage Life (HTSL, 150 degrees C), Temperature Cycling (TC, -65 degrees C - 150 degrees C) and unbiased Humidity Accelerated Stress Test (uHAST, 130 degrees C/85% relative humidity (RH)). The effect of plasma treatment prior bonding on 2N and 4N wires is discussed and compared to the results without plasma treatment prior wire bonding. Furthermore, test acceleration by using elevated test temperatures (HTSL, 250 degrees C) is shown and the wire capability compared.