Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation

摘要

A fibre orientation dependent material model of the thermoset is implemented to predict the lifetime of electronic components as a part of 2nd level encapsulated packages. Experimental data are used in combination with coupled simulations (process simulation - fibre orientation dependant material model - thermo-mechanical simulation) for defining this lifetime prediction model. An already existing lifetime prediction model based on the Coffin-Manson relation is used initially to evaluate the prediction accuracy. The prediction model is then adjusted and fitted for the current application.