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A comprehensive evaluation of radiation hardening by applying negative body bias and back-gate bias in 130 nm PDSOI technology

机译:通过在130 nm PDSOI技术中应用负体偏置和背栅偏置对辐射硬化进行综合评估

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摘要

This paper comprehensively evaluates the effects of negative body bias and negative back-gate bias on the total ionizing dose (TID) effects in 130 nm partially-depleted (PD) SOI technology. We studied the T-gate/H-gate nMOSFETs and pMOSFETs, and found that the negative body bias is ineffective for radiation hardening. However, the negative back-gate bias is an effective method for hardening the nMOSFETs. When the back-gate is biased at -2.5 V during irradiation and measurement, the TID tolerance can be improved from below 50 krad (Si) to up 100 krad(Si) while the performance of pMOSFETs is not degraded. 3D TCAD simulations are performed to analyze the failure of the negative body bias and the effective mechanism of the negative back-gate bias.
机译:本文全面评估了130纳米部分耗尽(PD)SOI技术中负体偏压和负背栅偏压对总电离剂量(TID)效应的影响。我们研究了T栅极/ H栅极nMOSFET和pMOSFET,发现负体偏置对辐射硬化无效。但是,负背栅偏置是用于硬化nMOSFET的有效方法。当在辐射和测量过程中将背栅偏置在-2.5 V时,TID容限可以从低于50 krad(Si)提高到高达100 krad(Si),同时不会降低pMOSFET的性能。进行3D TCAD仿真以分析负体偏置的失效和负背栅偏置的有效机制。

著录项

  • 来源
    《Microelectronics & Reliability》 |2020年第2期|113564.1-113564.9|共9页
  • 作者

  • 作者单位

    Chinese Acad Sci Shanghai Inst Microsyst & Informat Technol State Key Lab Funct Mat Informat Shanghai 200050 Peoples R China|Univ Chinese Acad Sci Beijing 100049 Peoples R China|Sci & Technol Reliabil Phys & Applicat Technol El Guangzhou 510610 Peoples R China;

    Chinese Acad Sci Shanghai Inst Microsyst & Informat Technol State Key Lab Funct Mat Informat Shanghai 200050 Peoples R China|Univ Chinese Acad Sci Beijing 100049 Peoples R China;

    Chinese Acad Sci Shanghai Inst Microsyst & Informat Technol State Key Lab Funct Mat Informat Shanghai 200050 Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Partially-depleted (PD); Silicon-on-insulator (SOI); Total-ionizing-dose (TID); Body bias; Back-gate bias; TCAD simulation;

    机译:部分耗尽(PD);绝缘体上硅(SOI);总电离剂量(TID);身体偏见;背栅偏置;TCAD模拟;

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