An investigation on shielding effectiveness of conductive adhesive

摘要

The use of metal shell is an effective method to solve electromagnetic interference caused by printed circuit board (PCB) of electronic equipment. Electromagnetic leakage mainly occurs at the junction of the upper metal shell and the lower metal shell. In order to reduce the electromagnetic interference caused by the electromagnetic leakage, the conductive adhesive is coated on the connection between the upper shell and the lower shell. In this paper, a simulation model of shielding effectiveness is established in CST STUDIO SUITE. It is mainly used to calculate the effects of conductivity and geometric size of conductive adhesives on shielding effectiveness. In the actual design process of electronic equipment, we can find a more economical combination of size and conductivity of conductive adhesives through the simulation of shielding effectiveness. The results can be used to guide the design of conductive adhesives to solve the electromagnetic compatibility problems of electronic equipment.