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SEU tolerance improvement in 22 nm UTBB FDSOI SRAM based on a simple 8T hardened cell

机译:基于简单的8T硬化单元,提高了22 nm UTBB FDSOI SRAM的SEU公差

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摘要

FDSOI technology has attracted considerable interests in space application due to its inherent high radiation resistance. An SEU hardened 8T SRAM cell is proposed and implemented in a test memory chip with advanced 22 nm UTBB FDSOI technology. Heavy ion experimental results show that the threshold LET of SEU for proposed 8T structure cell is up to similar to 24 MeV center dot cm(2)center dot mg(-1) and less dependences of upset on data pattern and test modes are observed. Moreover, multiple bit upsets are not appeared in bitmap analysis results even under effective LET values at similar to 129 MeV center dot cm(2)center dot mg(-1). The P-bb body biasing shows low influence on SEU rates in irradiation test, while the N-bb body biasing has ability to adjust the SEU sensitivity in a certain range. The error rate prediction indicates that this nanoscale FDSOI hardened SRAM is suitable for space application in harsh radiation environment.
机译:FDSOI技术因其固有的高抗辐射性而在空间应用中吸引了相当大的兴趣。提出并采用先进的22 nm UTBB FDSOI技术在测试存储芯片中实现了SEU硬化的8T SRAM单元。重离子实验结果表明,拟议的8T结构单元的SEU阈值LET高达类似于24 MeV中心点cm(2)中心点mg(-1),并且观察到对数据模式和测试模式的依赖性较小。此外,即使在类似于129 MeV中心点cm(2)中心点mg(-1)的有效LET值下,位图分析结果中也不会出现多个位不安。在辐射测试中,P-bb体偏置对SEU率的影响很小,而N-bb体偏置具有在一定范围内调节SEU灵敏度的能力。错误率预测表明该纳米级FDSOI硬化SRAM适用于恶劣辐射环境中的空间应用。

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