Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method

摘要

This paper provides an analytical solution to solve for the electronic assembly random vibration problem. Additionally, this paper employs Taguchi method to investigate the fatigue life performance of electronic vehicles subjected to random vibrations loadings. The current work adopted and modified as necessary a previously published analytical solution to solve for the electronic assemblies random vibration problem. This solution is also used to solve for BGA's axial deflections, strains and stresses. In combination with Taguchi method, this was solution employed to investigate the printed circuit board (PCB) and the integrated circuit (IC) component geometries as well as ball grid array (BGA) solder ball dimensions on solder axial stresses and related that to fatigue life performance of electronic packages under random vibration loading. The results of this newly developed analytical solution are in great match with FEA results in terms of the solder joint axial deflections power spectral density (PSD) function. Also, the stress analysis results of Taguchi method showed that the smaller and thicker PCB as well as larger and thicker IC's might reduce solder stresses and hence improve the fatigue performance. Also solder dimensions, compared to PCB and IC, have minor effects on solder stresses and fatigue life behavior. Finally, an optimal design for best fatigue performance was suggested.