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Impact of interface traps on performance of Gate-on-Source/Channel SOI TFET

机译:接口陷阱对源极栅极/通道SOI TFET性能的影响

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摘要

Here, one of most important reliability issue of the semiconductor device, the effects of traps present at the oxide-semiconductor interfaces on gate-on-source/channel SOI TFET are investigated. Conventional SOI TFET, gate-on-source only TFET, and gate-on-source/channel TFET are compared and it is found that gate-on-source/channel TFET has better immunity to the interface trap charge variation. The gate-on-source/channel TFET exhibits higher on current and on-off current ratio than gate-on-source device. Preliminary analyses are presented for the proposed architecture for the parameters: gate-channel overlap, back gate voltage and buried oxide thickness in absence of interface traps. The back gate voltage has a significant effect on the channel-drain junction of the device, and hence, on the ambipolar current. Further, the device characteristics in presence of traps at the gate oxide-semiconductor interface and buried oxide-semiconductor interface are reported. The effect of trap concentration is observed on the transfer characteristics, capacitance, and cut off frequency. The front gate dielectric-semiconductor interface traps degrade on current, while the buried oxide-semiconductor interface traps affect the ambipolar current. The effect of back gate voltage on ambipolarity and on current of the proposed device is studied in detail in presence of traps.
机译:在此,研究了半导体器件最重要的可靠性问题之一,即在源极/沟道SOI TFET栅极上的氧化物半导体界面处存在的陷阱的影响。比较了传统的SOI TFET,仅源极栅极TFET和源极栅极/沟道TFET,发现源极栅极/沟道TFET具有更好的抗界面陷阱电荷变化的能力。源极/沟道TFET栅极比源极-栅极器件具有更高的导通电流和导通/截止电流比。初步分析了所提出的体系结构的参数:栅极-沟道重叠,背栅电压和在没有界面陷阱的情况下的掩埋氧化物厚度。背栅电压对器件的沟道-漏极结有很大影响,因此对双极性电流也有很大影响。此外,报告了在栅氧化物-半导体界面和掩埋氧化物-半导体界面处存在陷阱的器件特性。观察到陷阱浓度对传输特性,电容和截止频率的影响。前栅极电介质-半导体界面陷阱会因电流而降低,而掩埋的氧化物-半导体界面陷阱会影响双极性电流。在存在陷阱的情况下,详细研究了背栅电压对双极性和拟议器件电流的影响。

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